Embedded systems engineering,from electronics and firmwareto connected control platforms.

Quentesil Systems develops integrated electronics, firmware and digital systems for sensing, control and connected products—from architecture and functional prototypes through validation, small-batch builds and production-ready design.

View selected projects

Capabilities

Engineering across the embedded product stack.

Hardware & product

Embedded electronics & PCB design

Architecture, schematic capture and PCB development for compact control, sensing and connected products.

MCU / SoC carrier boards, custom control electronics and mixed-signal integration
Power conversion, battery interfaces and power-path design
Dense multi-layer layout with current, thermal and signal-integrity planning
DFM, BOM optimization, assembly preparation and production support

Hardware & product

Robotics, sensing & control

Sensing and actuation architectures for mobile, robotic and automated systems.

IMU, magnetic, angle, position, distance / ToF, GPS and sonar integration
Filtering, calibration, thresholds and measurement-state logic
BLDC, DC motor and multi-channel servo control
Grounding, noise, signal-integrity and thermal design around real actuators

Hardware & product

Prototype, sourcing & small-batch production

Support beyond design files—from sourced parts and first assemblies through validated low-volume hardware.

In-house prototype and small-batch electronics assembly
Component sourcing, alternative-part selection and BOM optimization
Hand assembly, rework, board bring-up, inspection and functional validation
PCB fabrication / assembly coordination, DFM / DFA and manufacturing packages

Firmware & connectivity

Firmware, RTOS & device interaction

Low-level software and product behavior developed together with the hardware.

C / C++ firmware, drivers, hardware abstraction and embedded task architecture
ESP-IDF, FreeRTOS and peripheral integration across I²C, SPI, UART, CAN, USB and ADC
Persistent configuration, diagnostics, self-test and recovery behavior
Compact-display UI, buttons, calibration flows and device-state interaction

Firmware & connectivity

Wireless, networking & data transport

Reliable communication paths from embedded targets to radios, coprocessors, hosts and applications.

Bluetooth Low Energy, pairing, bonding, encryption and Wi-Fi integration
Proprietary 2.4 GHz links, USB CDC and UART / SPI transport bridges
Framed protocols with sequencing, reordering, retransmission and telemetry
WebSocket, JSON, MQTT and device-to-application protocol integration

Firmware & connectivity

Secure firmware lifecycle & reliability

Update and recovery mechanisms designed into the product architecture from the start.

Signed firmware verification, integrity checks and metadata gating
OTA / local update workflows, rollback and post-update self-test
Bonded / encrypted update authorization and local arming logic
Secure-boot, flash-protection and production-hardening planning

Advanced systems

Edge systems & application integration

Integration layers that connect physical-world data, embedded computation and higher-level applications.

Real-time middleware, data normalization and hardware-to-application architectures
Sensor-driven HMI, spatial / active-object interaction and edge processing
Application-facing APIs, SDK integration and TypeScript interface components
Connected control, telemetry and context-aware interaction workflows

Advanced systems

FPGA & deterministic digital systems

Programmable logic for workloads that need deterministic timing, parallel processing and hardware-defined data paths.

FPGA architecture, RTL, VHDL and Amaranth HDL development
Open-source synthesis and place-and-route with Yosys and nextpnr
Parallel stream / packet pipelines, state machines and low-latency logic
Hardware-timed framing, checking, sampling and FPGA ↔ MCU / host integration

Advanced systems

Ethernet, packet processing & network test

Low-level packet engineering for generation, capture, validation, replay and deterministic test infrastructure.

Raw Ethernet frame generation, parsing, injection and validation
libpcap / Npcap tooling plus PCAP generation and replay workflows
Filtering, checksums / CRC, timestamping, VLAN-aware processing and diagnostics
FPGA-assisted packet pipelines and low-latency network instrumentation

Selected engineering work

Engineering for physical systems,
across multiple domains.

Selected work across aerial, ground, surface and connected systems. Each project is presented as evidence of reusable engineering capability rather than as a narrowly defined end product.

Aerial systemsGround roboticsSurface systemsConnected systems

01 / aerial systems · control electronics

Bottom side PCB layout view of a custom flight controller design — PCB bottom

Top side PCB layout view of a custom flight controller design — PCB top

Top side assembled 3D view of a custom flight controller board — Assembly top

Updated bottom side assembled 3D view of a custom flight controller board — Assembly bottom

01 / Aerial systems · embedded control

Compact STM32H7 aerial control platform

A custom 37 × 37 mm aerial control platform developed for high-integration embedded control. The project combines a dense 6-layer PCB layout with populated assembly planning, bringing together a STM32H753 MCU, precision inertial, magnetic and barometric sensing, onboard logging, CAN connectivity, FRAM and a compact power architecture.

MCUSTM32H753IIK6
SensingICM-45686 · BMM350 · BMP581
InterfacesCAN · SDMMC · FRAM
Views shownPCB top/bottom · assembly top/bottom
Format37 × 37 mm · 6-layer PCB

PCB designEmbedded hardwareSensorsSystem integration

02 / connected systems · spatial interaction

Illustrative active-object recognition scene on an interactive planning surface — Illustrative active-object interaction scene

Illustrative urban-planning surface with multiple recognized active objects and spatial tag orientation — Illustrative urban-planning and scenario table

Recognition + integration path

01 Active objects identity · X/Y position · orientation

02 DISPLAX + Qt PCAP SDK · C++ middleware

03 WebSocket ID · position · orientation data

04 Intuiface IA TypeScript · experience logic

02 / Connected systems · spatial interaction

Real-time physical-object interaction system

A custom C++/Qt middleware layer and TypeScript Interface Asset connected DISPLAX PCAP hardware and active objects to Intuiface experiences. The integration recognized and distinguished multiple physical objects placed on the interactive surface, tracked their identifiers, real-time X/Y position and—most importantly—their spatial orientation, then translated low-level device events into application-ready interaction data.

Normalized state was delivered over a WebSocket / JSON interface, separating hardware communication from experience logic while supporting responsive object placement, movement, removal and interaction events such as tap and double-tap. Orientation data from the tags was especially valuable, because it allowed the application to interpret not only which object was present and where it was placed, but also how it was oriented—an essential capability for rich active-object-recognition workflows.

RecognitionActive objects · unique IDs · multi-object state
TrackingX/Y position · spatial orientation · placement · movement
Key signalTag orientation / rotation data for context-aware interaction
MiddlewareC++ · Qt · DISPLAX SDK
TransportWebSocket · JSON
ApplicationTypeScript · Intuiface Interface Asset
EventsObject state · tap · double-tap · orientation-aware behaviors
Applicable toCollaborative planning · interactive visualization · gaming

Strategic relevance

Physical object recognition → orientation-aware middleware → normalized transport → application context: a reusable integration pattern for intelligent interfaces, collaborative planning, interactive visualization, gaming and other sensor-driven edge systems.

Active-object recognitionOrientation-aware interactionMiddlewareHMI / edge integration

03 / ground robotics · motion + power

Top-side PCB layout of a modular robotics controller board — Controller PCB · top

Bottom-side PCB layout of a modular robotics controller board — Controller PCB · bottom

Assembled top side of the modular robotics controller board — Assembly · top

Assembled bottom side of the modular robotics controller board — Assembly · bottom

03 / Ground robotics · motion & power

Modular ground robotics controller

A custom controller PCB developed as the control plane for a compact ground-robotics platform. The design integrates DC motor drive, multi-channel servo control, I²C peripherals, GPIO expansion and battery power management into a single modular board, while keeping the host-controller interface deliberately simple.

The hardware combines a dual H-bridge motor driver, an I²C-based PWM controller for multiple servo outputs, a GPIO expander, and charging / boost-regulation circuitry. High-current motor paths, sensitive control signals and shared power rails were treated as a system-level layout problem, with attention to noise, signal integrity and practical integration into a real robot.

MotionDual H-bridge DC motor control · multi-channel servo outputs
ExpansionI²C PWM controller · GPIO expander · shared bus architecture
PowerBattery management · charging · boost regulation
Host linkCompact power + I²C interface for ESP32 or other host controller
Design focusHigh-current routing · noise control · signal integrity · manufacturable layout

System architecture

A reusable control-board pattern for mobile robots, compact automation platforms and other embedded systems where motors, servos, distributed I²C devices and battery power must coexist reliably.

Motor controlServo controlPower electronicsI²C architecturePCB design

04 / ground robotics · sensing + actuation

Assembled front side of a compact ESP32-S3 sense carrier board — Assembly · front

Assembled back side of a compact ESP32-S3 sense carrier board — Assembly · back

Front-side PCB layout of a compact ESP32-S3 sense carrier board — PCB layout · front

Back-side PCB layout of a compact ESP32-S3 sense carrier board — PCB layout · back

04 / Ground robotics · sensing & actuation

Compact sensing & actuation carrier

A compact 22 × 35 mm ESP32-S3 carrier board developed for a compact ground-robotics sensing and actuation platform. Despite the tight footprint, the design integrates an ESP32-S3 module interface, motor-driver stage, power-path management, external connectors, a high-power LED, laser interface and 12 addressable RGB LEDs.

The work went beyond routing alone and included electrical review, current and trace-width planning, thermal considerations, dense placement/routing, BOM optimization, JLCPCB assembly preparation and production guidance. The result is a clean, manufacturable board that packs substantial functionality into a very constrained mechanical envelope.

Format22 × 35 mm compact carrier board
ComputeESP32-S3 module carrier for robotics / sensing integration
Integrated functionsMotor driver · high-power LED · laser interface · 12 RGB LEDs
Power architecturePower-path management · connector integration · current-aware layout
Delivery scopeElectrical review · BOM optimization · JLCPCB assembly prep · production guidance
Design focusDense PCB layout · thermal/current planning · manufacturable packaging

Engineering value

A representative Quentesil pattern for compact embedded carrier boards: integrating compute, power, actuation and user-facing features into a production-ready module under severe space constraints.

ESP32-S3Carrier board designDense PCB layoutProduction preparation

05 / surface systems · control + power

Top-side PCB layout of an ESP32-S3 surface robotics controller — PCB layout · top

Bottom-side PCB layout of an ESP32-S3 surface robotics controller — PCB layout · bottom

Assembled top side of an ESP32-S3 surface robotics controller — Assembly · top

Assembled bottom side of an ESP32-S3 surface robotics controller — Assembly · bottom

05 / Surface systems · control & power

Surface robotics control platform

A high-integration controller developed for a battery-powered surface-robotics platform, combining ESP32-S3 compute with interfaces for multiple servos, BLDC propulsion, GPS, sonar and lighting. The board also incorporates dual-rail buck regulation for high-current power distribution, bringing control, sensing and power management together on one production-oriented platform.

The design was developed from schematic through layout with attention to component performance, availability and cost. PCB partitioning, grounding and high-current routing were optimized around EMI, thermal efficiency and signal integrity, while the mechanical and connector arrangement was kept clear and serviceable for real-world surface-platform integration.

ComputeESP32-S3 embedded control platform
MotionMultiple servo channels · BLDC propulsion interfaces
SensingGPS · sonar · navigation and peripheral connectivity
PowerDual-rail buck regulation · high-current distribution
AuxiliaryHeadlight / sidelight control · dedicated peripheral connections
Engineering focusEMI · grounding · thermal efficiency · signal integrity · DFM

System architecture

A compact surface-platform controller that integrates propulsion, actuation, navigation sensors, auxiliary loads and regulated power—representative of Quentesil’s work on complete embedded control platforms rather than isolated circuit functions.

ESP32-S3Surface roboticsPower architectureSensor integrationDFM

Company

Quentesil Systems UG (haftungsbeschränkt)

A Germany-based engineering technology company developing embedded electronics, firmware, programmable logic and integrated control platforms.

Quentesil works across compact electronics, robotics, sensing, connectivity and deterministic data systems, with engineering applicable to aerial, ground, surface and other field-deployed platforms. Work can extend from architecture and PCB development through firmware, in-house prototypes, validation and low-volume production support.

Registered address: Florianstraße 15–21
44139 Dortmund
Germany
Managing director: Rijo Varghese
Commercial register: Amtsgericht Dortmund
HRB 38804

Contact

Start a conversation.

Describe the product, technical challenge or development stage. A concise outline is enough to begin.